Microstructure Evolution of Tin–Lead Solder

Effects of process conditions on reliability, microstructure evolution and failure modes of SnAgCu solder joints

In this study, microstructure evolution at intermetallic interfaces in SnAgCu solder joints of an area array component was investigated at various stages of a thermal cycling test. Failure modes of solder joints were analyzed to determine the effects of process conditions on crack propagation. Lead-free printed-circuit-board (PCB) assemblies were carried out using different foot print designs o...

Evolution of Microstructure

Inhomogeneous deformation and microstructure evolution of Sn-Ag-based solder interconnects during thermal cycling and shear testing

0026-2714/$ see front matter 2012 Elsevier Ltd. A doi:10.1016/j.microrel.2012.01.009 ⇑ Corresponding author at: Department of Materi Shenzhen Graduate School, Harbin Institute of Tec China. Tel.: +86 755 26033463; fax: +86 755 260334 E-mail address: [email protected] (M.Y. Li). Orientation imaging microscopy was adopted to characterize the microstructural changes in Sn–Agbased solder interconnect...

Evolution of Microstructure: An Example

Evolution of Microstructure in Porous

We study the ow of two immiscible uids of diierent density and mobility in a porous medium. If the heavier phase lies above the lighter one, the interface is observed to be unstable. The two phases start to mix on a mesoscopic scale and the mixing zone grows in time | an example of evolution of microstructure. A simple set of assumptions on the physics of this two{phase ow in a porous medium le...